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The manufacturing of printed circuit boards (PCBs) is a complex process that combines precision technology with rigorous technical documentation. To achieve high-performance and reliable products, manufacturers and clients must adhere to a series of technical conditions, design requirements, and mandatory specifications. Below, we briefly present the main information necessary for the correct execution of a PCB order, according to current industry standards.
1. Dimensions and technical specifications of PCBs
Before placing an order, it is important that the boards comply with the technological limits of the production process. The accepted standard dimensions are:
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SMD assembly boards: between 50 × 40 mm and 460 × 400 mm (with the possibility of extending to 740 × 460 mm for certain production lines).
THT assembly and soldering boards: up to 410 × 380 mm.
PCB thickness: between 0.5 and 4 mm.
Minimum SMD component: 0201 (0.5 × 0.25 mm).
Minimum distance between integrated circuit terminals: 0.3 mm.
These criteria ensure compatibility with automated assembly equipment and guarantee a precise and reliable final result.
2. Technology used in the assembly process
Modern PCB manufacturing integrates fully automated stages, as well as manual operations for special components. The standard process includes:
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Front-back SMD assembly, with convection soldering (reflow);
Simultaneous application of solder paste and adhesive, when necessary;
THT soldering by wave or selective;
2.5D and 3D AOI inspection for automatic placement verification;
ICT testing and functional testing (FT) for final product validation.
These methods ensure quality control and reduce the risk of defects in production.
3. Documentation required for quoting or ordering
To manufacture a printed circuit board under optimal conditions, the client must provide a complete set of technical information. The standard documentation includes:
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Required quantities (lot and annual estimate).
Bill of Materials (BOM) with type, value, tolerance, package, and reference.
Auxiliary materials (screws, labels, cables, etc.).
List of materials provided by the client.
Gerber RS274X files, drilling and milling files, PCB specifications (thickness, copper layer, solder mask color, coating, etc.).
Pick & place file or PCB project for generating SMD coordinates.
Functional testing instructions and software for programming microcontrollers.
Images or technical drawings for component orientation, soldering protections, label positioning, etc.
Packaging method and applicable standards.
A complete set of documents reduces the risk of errors, prevents delays, and allows for a quick and accurate execution of the order.
4. Requirements for ICT testing
To perform an in-circuit test (ICT), the following are required:
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Gerber files;
List of test pads and their coordinates;
Netlist;
Complete list of components with values and tolerances;
Detailed electrical schematic.
This data allows for the construction of the test adapter and the correct validation of the board before delivery.
The professional assembly of printed circuit boards directly depends on the quality of the documentation and adherence to the technical conditions imposed by the manufacturer. By providing accurate information from the quoting stage, costs, production time, and the risk of defects are significantly reduced, thus ensuring the achievement of high-performance and reliable PCBs.